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200ml Red resin SMT adhesive used for wav soldering technique
Specification of Red resin SMT wlding adhesive
    Composition  SMT Epoxy resin
     Appearance   Paste/red-colored
  Specific gravity 1.25
 Viscosity at 25°C,5rpm 350Pa·S
 Thixotropy index 6.8(1rpm/10rpm)
Adhesive Strength  2125C
Mini-mold tr
SOP·IC 16P                              		 44N(4.5kgf)0.2mgr twin
45N(4.6kgf)0.3mgr twin
92N(9.4kgf)0.8mgf single×2
     Electric Property
 Volume resistance
    Insulation resistance
    Initial value
    After treating*
   Dielectric constant
   Dielectric loss tangent		  
3.6×1016Ω·cm    JIS K6911
 
1.2×1014Ω                JIS Z3197
1.2×1012Ω               
3.12/1MHZ      JIS K6911
0.012/1MHZ     JIS K6911
   Preservation condition 10°C
To be strictly kept at less than
10°C in refrigerator
 
Epibond Surface Mount Adhesives in clude Dispensing and  Frictioning /stencil using two kinds of techniques.
We make 30ml 200ml and 300ml per syringe packing.